SCAPE’s 4th General Assembly was marked by an enlightening session on Advanced Printed Circuit Boards (PCBs) led by Thomas Gottwald, Chief Technology Officer of Schweizer Electronic AG. The event, held under the banner of the Institut de Microelectrònica de Barcelona’s (IMB-CNM, CSIC) IMBCNMtalks series, offered participants an in-depth look into the cutting-edge PCB technologies developed by SCHWEIZER, Europe’s largest PCB manufacturing plant.

Gottwald, who recently joined the SCAPE Advisory Board, showcased SCHWEIZER’s innovative in-house chip-embedding technology, known as p² Pack – Power PCB Pack. This technology is designed to meet the rigorous demands of power electronics applications, such as high-voltage insulation and high-power dissipation, making it a significant advancement in the field.

SCAPE is currently collaborating with SCHWEIZER to incorporate this custom PCB service into its chip-embedding activities, which are critical for the development of project prototypes. During his presentation, Gottwald emphasized the increasing importance of chip-embedding in the e-mobility industry, highlighting its benefits in achieving high power density, reducing energy losses, and enabling more compact designs—a crucial consideration in the electrification of the automotive sector.

The session also provided a glimpse into the future of this technology, with Gottwald discussing the ongoing development and pre-development stages of the second and third generations of the p² Pack technology. As SCAPE continues to explore the potential of chip-embedding in automotive electrification, the insights gained from this session underscore the promising future of this innovative technology.

Watch the video, here.